1. Robot obstacle avoidance
1.ToF LiDAR Horizontal cavity surface-emitting Laser (HCSEL) combines the high power output of Edge emitting laser (EEL) and the advantages of VCSEL, which are more suitable for mass production. It can simultaneously meet the three major requirements of laser sources for lidar applications: Higher peak power, smaller spectral temperature drift and longer laser wavelengths. HCSEL allows for longer 3D sensing distances, higher signal-to-noise ratios and human eye safety. | Product recommendation: 940/976nm HCSEL chip |
2. The sweeper is equipped with one set of large-angle flat-top light field HCSEL line laser module, and with the optical scheme independently developed by LEMON Photonics: Only one group of HCSEL line laser module can cover the remote and near environment, the HCSEL module emit 8 line lasers. | Product recommendation: HCSEL line modules 940/976nm HCSEL chip
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3. Line laser scanning module The performance of cleaning along the wall and actively avoiding obstacles such as people and data lines has been doubled. The linear laser module has the advantages of good consistency, extremely low wavelength temperature sensitivity, stable output power, M-type high quality linear light field and so on. | Product recommendation: |
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![]() Proximity Sensing 810/850/940nm VCSEL Structured light illumination 810/850/940nm VCSEL Laser autofocus 940nm VCSEL d ToF/ i ToF 940nm VCSEL VCSEL chips Aging test >3000 hours, constant power of VCSEL > VCSEL Service life requirements for 30x mobile phone VCSEL Passed the environmental reliability test. | Product recommendation: VCSEL Chips |
3D vision solution
Triangulation was used to measure stereo vision schemes LEMON Photonics' VCSEL point laser collimation module adopts customized VCSEL single point chip. Compared with traditional EEL collimation module, LEMON Photonics' VCSEL point laser collimation module has the advantages of low temperature drift coefficient, high spot round and uniformity, strong anti-static ability, high reliability, easy packaging and high cost performance. | Product recommendation: Laser module 808 850 940nm spot VCSEL |
dToF LiDAR The multi-junction VCSEL chip family features high power density, high reliability and excellent high temperature performance for a wide range of short pulse (ns class) and peak power applications. Multi-junction technology represents the next leap in the VCSEL industry, bringing many advantages to machine vision applications. The high power density can reduce the package size and optimize the system architecture, while the high electro-optical conversion efficiency can reduce the thermal load of the whole machine, and the high slope efficiency can reduce the pulse current, thereby improving the switching speed of the driver chip. | Product recommendation: |
Structured light scheme LEMON Photonics VCSEL line laser module adopts customized VCSEL array chip and specially designed large angle line grating, which can achieve high quality linear light field. Its advantages over traditional EEL line light sources are as follows: (1)The industry's first large-angle flat-top light field: the 120° light field distribution without edge breaks has stronger edge energy, which is more conducive to large-angle radar to compensate for edge energy (2)The laser linewidth is narrower: the energy is more concentrated, and the signal-to-noise ratio is effectively improved in the spatial domain. (3)The temperature drift coefficient is small of VCSEL: it is 1/5 of the EEL, and the receiver can use a narrower filter to effectively improve the signal-to-noise ratio in the frequency domain; (4)Higher reliability: VCSEL luminous surface is larger than EEL, the relative power density is low, and the reliability is better; (5)High cost performance: VCSEL provides more optimized costs in chip, package and module assembly. | Product recommendation: |
3D sensing for ToF line scanning Linear scanning 3D sensing schemes have relatively high scheme integration, as well as relatively low cost of more mature linear array photoelectric receiver chips, so that linear scanning schemes have been paid more and more attention by the sensing industry. Conventional EEL and VCSEL laser chips are difficult to form relatively low-cost and small-volume uniform line spots through diffuser because of their large far-field divergence Angle. LEMON Photon's new HCSEL laser chip can greatly improve the sharpness and uniformity of the light field after diffuser shaping, with its near-collimated emission Angle in one direction, and achieve the ideal line spot in a small package size. For example, comparison of the light field effect of 2W VCSEL and HCSEL after the same 120° x 1° diffuser. | Product recommendation: |