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① Semiconductor laser chip packaging and module packaging;

②chip new product development process process testing, output sampling report and other process development and production process improvement;

③ research, feel, test different materials and applications of the laser process, complete parameter optimization, and write process test reports;

④ The company focuses on training objects, rotating production, process, engineering and other departments after the finalization of the post.

① Mechanical design, automation, optical mechatronics, applied physics, optical instrumentation, optoelectronics, optical engineering, optical information science and technology and other optics-related majors, bachelor degree or above, master degree or above is preferred;

② Proactive, strong sense of responsibility, strong self-discipline, the ability to work independently and withstand pressure; high work ethic, good teamwork spirit; good communication and collaboration skills; good written writing skills; good logical thinking skills and thoroughness.

① Semiconductor laser chip packaging and module packaging;

②chip new product development process process testing, output sampling report and other process development and production process improvement;

③ research, feel, test different materials and applications of the laser process, complete parameter optimization, and write process test reports;

④ The company focuses on training objects, rotating production, process, engineering and other departments after the finalization of the post.

① Mechanical design, automation, optical mechatronics, applied physics, optical instrumentation, optoelectronics, optical engineering, optical information science and technology and other optics-related majors, bachelor degree or above, master degree or above is preferred;

② Proactive, strong sense of responsibility, strong self-discipline, the ability to work independently and withstand pressure; high work ethic, good teamwork spirit; good communication and collaboration skills; good written writing skills; good logical thinking skills and thoroughness.

① Semiconductor laser chip packaging and module packaging;

②chip new product development process process testing, output sampling report and other process development and production process improvement;

③ research, feel, test different materials and applications of the laser process, complete parameter optimization, and write process test reports;

④ The company focuses on training objects, rotating production, process, engineering and other departments after the finalization of the post.

① Mechanical design, automation, optical mechatronics, applied physics, optical instrumentation, optoelectronics, optical engineering, optical information science and technology and other optics-related majors, bachelor degree or above, master degree or above is preferred;

② Proactive, strong sense of responsibility, strong self-discipline, the ability to work independently and withstand pressure; high work ethic, good teamwork spirit; good communication and collaboration skills; good written writing skills; good logical thinking skills and thoroughness.

① Semiconductor laser chip packaging and module packaging;

②chip new product development process process testing, output sampling report and other process development and production process improvement;

③ research, feel, test different materials and applications of the laser process, complete parameter optimization, and write process test reports;

④ The company focuses on training objects, rotating production, process, engineering and other departments after the finalization of the post.

① Mechanical design, automation, optical mechatronics, applied physics, optical instrumentation, optoelectronics, optical engineering, optical information science and technology and other optics-related majors, bachelor degree or above, master degree or above is preferred;

② Proactive, strong sense of responsibility, strong self-discipline, the ability to work independently and withstand pressure; high work ethic, good teamwork spirit; good communication and collaboration skills; good written writing skills; good logical thinking skills and thoroughness.

① Semiconductor laser chip packaging and module packaging;

②chip new product development process process testing, output sampling report and other process development and production process improvement;

③ research, feel, test different materials and applications of the laser process, complete parameter optimization, and write process test reports;

④ The company focuses on training objects, rotating production, process, engineering and other departments after the finalization of the post.

① Mechanical design, automation, optical mechatronics, applied physics, optical instrumentation, optoelectronics, optical engineering, optical information science and technology and other optics-related majors, bachelor degree or above, master degree or above is preferred;

② Proactive, strong sense of responsibility, strong self-discipline, the ability to work independently and withstand pressure; high work ethic, good teamwork spirit; good communication and collaboration skills; good written writing skills; good logical thinking skills and thoroughness.

① Semiconductor laser chip packaging and module packaging;

②chip new product development process process testing, output sampling report and other process development and production process improvement;

③ research, feel, test different materials and applications of the laser process, complete parameter optimization, and write process test reports;

④ The company focuses on training objects, rotating production, process, engineering and other departments after the finalization of the post.

① Mechanical design, automation, optical mechatronics, applied physics, optical instrumentation, optoelectronics, optical engineering, optical information science and technology and other optics-related majors, bachelor degree or above, master degree or above is preferred;

② Proactive, strong sense of responsibility, strong self-discipline, the ability to work independently and withstand pressure; high work ethic, good teamwork spirit; good communication and collaboration skills; good written writing skills; good logical thinking skills and thoroughness.

① Semiconductor laser chip packaging and module packaging;

②chip new product development process process testing, output sampling report and other process development and production process improvement;

③ research, feel, test different materials and applications of the laser process, complete parameter optimization, and write process test reports;

④ The company focuses on training objects, rotating production, process, engineering and other departments after the finalization of the post.

① Mechanical design, automation, optical mechatronics, applied physics, optical instrumentation, optoelectronics, optical engineering, optical information science and technology and other optics-related majors, bachelor degree or above, master degree or above is preferred;

② Proactive, strong sense of responsibility, strong self-discipline, the ability to work independently and withstand pressure; high work ethic, good teamwork spirit; good communication and collaboration skills; good written writing skills; good logical thinking skills and thoroughness.

① Semiconductor laser chip packaging and module packaging;

②chip new product development process process testing, output sampling report and other process development and production process improvement;

③ research, feel, test different materials and applications of the laser process, complete parameter optimization, and write process test reports;

④ The company focuses on training objects, rotating production, process, engineering and other departments after the finalization of the post.

① Mechanical design, automation, optical mechatronics, applied physics, optical instrumentation, optoelectronics, optical engineering, optical information science and technology and other optics-related majors, bachelor degree or above, master degree or above is preferred;

② Proactive, strong sense of responsibility, strong self-discipline, the ability to work independently and withstand pressure; high work ethic, good teamwork spirit; good communication and collaboration skills; good written writing skills; good logical thinking skills and thoroughness.

① Semiconductor laser chip packaging and module packaging;

②chip new product development process process testing, output sampling report and other process development and production process improvement;

③ research, feel, test different materials and applications of the laser process, complete parameter optimization, and write process test reports;

④ The company focuses on training objects, rotating production, process, engineering and other departments after the finalization of the post.

① Mechanical design, automation, optical mechatronics, applied physics, optical instrumentation, optoelectronics, optical engineering, optical information science and technology and other optics-related majors, bachelor degree or above, master degree or above is preferred;

② Proactive, strong sense of responsibility, strong self-discipline, the ability to work independently and withstand pressure; high work ethic, good teamwork spirit; good communication and collaboration skills; good written writing skills; good logical thinking skills and thoroughness.